IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.
The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.
Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World !
IMAPS-France (French chapter) is a non-profit organization with 200 members in 2017 from 110 companies or institutes in France and neighbouring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World.
To that end, we organize events each year. In 2018-2019, in French OR English language, these are namely:
We will be glad to see you join us for one of these events.
Following the success of the Power Electronics Workshop organized over the past 10 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM and Polytech Tours, IMAPS-France proudly announces the 11th edition of the Power Electronics and Packaging Technical Workshop to be held in Tours, France on November the 28th, 2019. The city of Tours is located along the scenic Loire Valley which is famous for its castles built along the river. For the seventh time, the event’s scope becomes international and the workshop will be held in English. Please, don’t miss the date!!
he Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.
Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.
Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also
greater reliability; these trends also require improvements and changes in packaging and thermal materials.
Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels.
May 27-28, 2020
- parallel technical sessions
- an exhibition.
- additional technical events
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