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Who We Are...

 

Welcome to the IMAPS France

 

IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.

 The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.

Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World !

 IMAPS-France (French chapter) is a non-profit organization with 200 members in 2016 from 110 companies or institutes in France and neighbouring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World.

To that end, we organize events each year. In 2017, in French OR English language, these are namely:

 

  • DEMESYS 2017
  • RAMP 2017
  • MINAPAD 2017
  • POWER 2017
  • MEDICAL 2017
  • THERMAL 2018

 

We will be glad to see you join us for one of these events.

Bulletin d'adhésion IMAPS FRANCE

 

 

 

Upcoming Events:



RAMP 2017

RAMP 2017


 

 April 26-27, 2017

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is now being co-sponsored by IMAPS-France and IMAPS NA.

The technical workshop will be supported by a table top exhibition.


 

MINAPAD 2017

 

MINAPAD 2017

  • MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on  May 17,18, 2017
  • MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

           - parallel technical sessions

            - poster sessions

            - an exhibition. As of today, almost all the         booths are already booked.

            - tutorials, and additional  technical events       (May 16, 2017)

 


DEMESYS 2017

DEMESYS 2017

After a successful First Edition on 2015, Moroccan Foundation for Advanced Science Innovation and Research (MAScIR), International Microelectronics Assembly and Packaging Society (IMAPS-France) and Electronic, Microelectronic et Mechatronic Cluster of Morocco (CE3M), are pleased to announce the Call for Papers for the 2nd Edition of DeMESys: the International Conference on Development and Manufacturing of Electronic Systems. This conference will be held at Rabat Design Center and will feature 2 days of selected technical presentations focusing on a range of important topics related to the Electronic & Microelectronic systems and their applications.

DeMESys conference is the occasion for attendees involves in the electronic supply chain to present recent researches, exchange about new ideas and solutions, and explore opportunities for the future.

POWER 2017

POWER 2017

Following the success of the Power Electronics Workshop organized over the past 8 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics and éolane, IMAPS-France proudly announces the 9th edition of the Power Electronics and Packaging, Technical & International Workshop to be held in Tours, France on October the 11th and 12th, 2017. The city of Tours is located along the scenic Loire Valley which is famous for its castles built along the river. For the fifth time, the event’s scope becomes international and the workshop will be held in English.

THERMAL 2018

EMPC 2017

EMPC 2017

The forthcoming EMPC 2017 will build on the successful forerunning EMPCs – the latest were in Germany (2015) and France (2013) – to benefit exhibitors and technical contributors. EMPC brings together the entire microelectronics supply chain, technical and marketing professionals from around the world.
 
The International Microelectronics and Packaging Society (IMAPS) is a worldwide organization, which leads communication, education and interaction at all levels in the field. IMAPS is dedicated to the growth of the community focused on developments of microelectronics and packaging technologies of the present and future, including 3D Integration, SMT, CoB and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF, HT and Power-Electronics, Flexible Electronics, Advanced Materials, Thermal Management, Modeling/Design/Simulation, Reliability.
 
For the first time the conference is organized in eastern part of Europe. This gives an extra opportunity to bring together the entire microelectronics supply chain, technical and marketing professionals from all parts of Europe. The variety of sessions offers the possibility to enhance professional development, technical knowledge/skills and career progression. Furthermore, the industrial exhibition will highlight the latest products and service applications of value to the electronics community.
 
The conference is an important platform for dialogue between industry and academia. At EMPC 2017, we will provide you with an excellent technical programme of most recent research and development results worldwide.
 
Don’t miss the opportunity to meet international experts and exchange experience, gain ideas and cutting edge information of microelectronics and packaging industries at EMPC 2017.

We look forward to welcome you to an inspiring and stimulating event.
Save the date: 10th – 13th September 2017