IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.
The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.
Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World !
IMAPS-France (French chapter) is a non-profit organization with 200 members in 2015 from 110 companies or institutes in France and neighbouring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World.
To that end, we organize events each year. In 2016, in French OR English language, these are namely:
We will be glad to see you join us for one of these events.
Pour perpétuer la tradition, nous vous proposons un atelier consacré à la connectique et à la législation REACH. Quelques nouveautés pour cette quatrième édition après 2008, 2010 et 2011 mais commençons par le début :
Les 21 et 22 septembre 2016 se déroulera à Paris, le workshop INTERCONEX 2016. Cet évènement se fera en coopération avec l’association ACSIEL.
Le lieu retenu est un centre de conférences qui s’appelle Eurosite La République. Nous avions retenu ce site en juin sans présager des tristes évènements de novembre 2015.
Les sessions aborderont les différentes facettes de l’interconnexion :
Nous ferons appel à vous pour présenter vos derniers développements, fournisseurs ou utilisateurs, vos retours d’expérience seront les bienvenus.
Following the success of the Power Electronics Workshop organized over the past six years in partnership with GREMAN (UMR 7347) and Polytech-Tours, IMAPS-France proudly announces the 8th edition of the Power Electronics and Packaging Technical and International Workshop to be held in Tours, France on October the 13h, 2016. The city of Tours is located along the scenic Loire Valley which is famous for its castles built along the river.
For the fourth time, the event’s scope becomes international: the workshop will be held in English as the official language
The French IMAPS Chapter presents the 4th Advanced Technology Workshop on Microelectronics, Systems and PackagingFor Medical Applicationsin Lyon
Save the date: 7-8 december 2016
Fo more than 40 years IMAPS is the leading Microelectronics Packaging, Interconnect and Assembly society, facilitating means of communication, education and interaction at all levels. IMAPS is dedicated to the advancement and growth of the community, with focus on developments in packaging technologies of the present and future (3D Integration, SMT, CoB- and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, MEMS, High Frequency, Advanced Materials, Modelling/Design/Simulation, Reliability amongst others).At the ATW MEDICAL 2016, we will provide you with excellent presentations and exhibitors of most recent research and development results worldwide. Bringing together the microelectronics implantable and wearable, administrative regulations and marketing professionals. The variety of sessions offer the possibility to enhance professional development, technical knowledge/skills and enables career progression. Furthermore, the industrial exhibition will highlight materials, products, equipment and service applications of the current technology. We look forward to welcoming you to an inspiring and stimulating event.
The conference is an important platform for the dialogue between industry (manufacturers) and academia (researchers). Don’t miss the opportunity to meet international experts and exchange experience, ideas and cutting edge information of microelectronics and packaging industries at the ATW MEDICAL 2016.
ATW MEDICAL 2016 is pleased to welcome all participants to LYON METROPOLE congress hotel (http://www.resorthotellyon.co.uk ).
February 1st & 2nd, 2017
The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.
Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.
Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also
greater reliability; these trends also require improvements and changes in packaging and thermal materials.
Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels.