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Who We Are...

 

Welcome to the IMAPS France

 

IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.

 The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.

Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World !

 IMAPS-France (French chapter) is a non-profit organization with 200 members in 2015 from 110 companies or institutes in France and neighbouring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World.

To that end, we organize events each year. In 2016, in French OR English language, these are namely:

 

  • MEDICAL 2016
  • THERMAL 2017
  • DEMESYS 2017
  • RAMP 2017
  • MINAPAD 2017
  • DEMESYS 2017
  • POWER 2017
  • MEDICAL 2017

 

We will be glad to see you join us for one of these events.

Bulletin d'adhésion IMAPS FRANCE

 

 

 

Upcoming Events:



THERMAL 2017

THERMAL 2017


 

 February 1st & 2nd, 2017

The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.  

Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. 

Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also 

greater reliability; these trends also require improvements and changes in packaging and thermal materials.  

Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels. 

MINAPAD 2017

 

MINAPAD 2017

  • MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on  May 17,18, 2017
  • MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

           - parallel technical sessions

            - poster sessions

            - an exhibition. As of today, almost all the         booths are already booked.

            - tutorials, and additional  technical events       (May 16, 2017)

 


DEMESYS 2017

DEMESYS 2017

After a successful First Edition on 2015, Moroccan Foundation for Advanced Science Innovation and Research (MAScIR), International Microelectronics Assembly and Packaging Society (IMAPS-France) and Electronic, Microelectronic et Mechatronic Cluster of Morocco (CE3M), are pleased to announce the Call for Papers for the 2nd Edition of DeMESys: the International Conference on Development and Manufacturing of Electronic Systems. This conference will be held at Rabat Design Center and will feature 2 days of selected technical presentations focusing on a range of important topics related to the Electronic & Microelectronic systems and their applications.

DeMESys conference is the occasion for attendees involves in the electronic supply chain to present recent researches, exchange about new ideas and solutions, and explore opportunities for the future.